Click to sort rows by QPU name header in ascending order | Click to unsort rows by Qubits header | Click to sort rows by 2Q error (best) header in ascending order | Click to sort rows by 2Q error (layered) header in ascending order | Click to sort rows by CLOPS header in ascending order | Click to sort rows by Status header in ascending order | Click to sort rows by Total pending jobs header in ascending order | Click to sort rows by Processor type header in ascending order |
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ibm_pittsburgh | 156 | 7.08E-4 | 3.67E-3 | CLOPS_h: This QPU is measuring hardware-aware circuit layer operations per second. | Online | 622 | Heron processor: At 156 qubits, Heron pulls in substantial innovations in signal delivery that were previously deployed in Osprey. |
ibm_kingston | 156 | 9.22E-4 | 4.01E-3 | CLOPS_h: This QPU is measuring hardware-aware circuit layer operations per second. | Online | 399 | Heron processor: At 156 qubits, Heron pulls in substantial innovations in signal delivery that were previously deployed in Osprey. |
ibm_fez | 156 | 1.25E-3 | 4.52E-3 | CLOPS_h: This QPU is measuring hardware-aware circuit layer operations per second. | Online | 250 | Heron processor: At 156 qubits, Heron pulls in substantial innovations in signal delivery that were previously deployed in Osprey. |
ibm_marrakesh | 156 | 1.01E-3 | 3.49E-3 | CLOPS_h: This QPU is measuring hardware-aware circuit layer operations per second. | Online | 821 | Heron processor: At 156 qubits, Heron pulls in substantial innovations in signal delivery that were previously deployed in Osprey. |
ibm_torino | 133 | 1.37E-3 | 1.04E-2 | CLOPS_h: This QPU is measuring hardware-aware circuit layer operations per second. | Online | 557 | Heron processor: At 156 qubits, Heron pulls in substantial innovations in signal delivery that were previously deployed in Osprey. |
ibm_brisbane | 127 | 3.25E-3 | 1.98E-2 | CLOPS_h: This QPU is measuring hardware-aware circuit layer operations per second. | Online | 3,681 | Eagle processor: At 127 qubits, the Eagle processor family incorporates more scalable packaging technologies than previous generations. |
